Technology Introduction:
This project develops a 3D packaging bonding solution and smart platform integrating light-based surface treatment, mini electrochemical sensing, and AI prediction. It enables real-time analysis of copper oxidation and estimation of Cu–Cu bonding strength. Featuring portability, vacuum-free and non-destructive operation, and real-time feedback, it enhances yield, efficiency, and stability. The technology offers strong potential for next-generation semiconductor manufacturing.
Industry Applicability:
This technology targets key 3D packaging processes such as hybrid bonding in heterogeneous integration, replacing plasma treatments by enabling copper diffusion without vacuum. With integrated mini electrochemical sensing and AI prediction, it enables real-time oxide monitoring and automated control. The approach improves bonding strength and yield, offering high compatibility, scalability, and strong potential for commercialization and production deployment.