It will promote the intelligent transformation and upgrading of semiconductor peripheral equipment. In the future, a high-precision automatic needle adjustment system can be developed in combination with intelligent probe automatic alignment technology, in order to achieve the upgrade from human-machine collaboration to fully automatic intelligent needle adjustment, greatly speeding up the system needle adjustment time and reducing the dependence on skilled inspection personnel.
The rapid automatic alignment technology and Auto Focus technology are introduced and a high-precision calibration microscopic image coordinate system is established to assist the existing manpower in the automated full-range inspection of probe cards, achieving a human-machine collaborative alignment mechanism to reduce the probe adjustment time.