3D Aluminum-Microchannel Thermosyphon Heat Sink
‧ Technological Innovation – 3D Aluminum-Microchannel Thermosyphon Heat Sink is a next-gen air-cooling technology tailored for high-performance computing servers. Using capillary-free microchannels and balanced pressure control, it can dissipate over 1,500 W of heat even under low airflow conditions, without pumps or leakage risks. The system delivers liquid-cooling-level performance with air-cooling simplicity, making it a lightweight, durable, and cost-effective thermal solution.
‧ Competitive or Intellectual Property Advantages – Core patents on wickless two-phase microchannels and a comprehensive global IP portfolio create strong technical barriers and mass-production competitiveness.
‧ Important Achievements / Awards – 2026 Edison Awards
‧ Competitive or Intellectual Property Advantages – Core patents on wickless two-phase microchannels and a comprehensive global IP portfolio create strong technical barriers and mass-production competitiveness.
‧ Important Achievements / Awards – 2026 Edison Awards
Industrial Applications:
An all-aluminum build replaces copper heat sinks—about $2,592/ton vs. $9,334/ton—reducing cost and weight. In a $12B 2025 data-center cooling-module market where air cooling still holds ~79%, our drop-in design pushes air cooling to the top end, bridging the gap to liquid cooling without pumps, pipes, or leak risk. We plan a 2026 startup to commercialize this scalable, reliable solution.
Using lightweight, recyclable aluminum instead of copper further reduces environmental impact, helping build a more sustainable digital infrastructure. This will enable denser, more efficient data centers, support AI applications across industries, and strengthen next-generation high-performance computing.
Industrial Technology Research Institute
ITRI is a world-leading applied technology research institute with more than 6,500 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Contact Information
Name：Vance Zhang
Tel：03-5916340
Address：No. 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu County 310401, Taiwan (R.O.C.)
Additional Information
Pavilion：Innovation Economy Pavilion IA01
Exhibiting Entity：Energy Administration,MOEA
Application Category：Electronics and Optoelectronics
More
Pavilion：Innovation Economy Pavilion IA01
Exhibiting Entity：Energy Administration,MOEA
Application Category：Electronics and Optoelectronics