Technology Introduction:
AlixLabs' unique and patented Atomic Layer Pitch Splitting (APS) is a novel plasma-based etching method that selectively targets surface topology. This breakthrough technology eliminates several complex steps in chip manufacturing, enabling more efficient, cost-effective, and sustainable semiconductor production.
Industry Applicability:
APS enables cost-efficient scaling of semiconductor devices by doubling pattern density. It reduces manufacturing costs, lowers energy use, and supports sustainable, high-volume production. Applicable in logic, memory, and power devices, APS accelerates industrial adoption with scalable chip manufacturing.