Pyroelectric Energy Recycle of Fluorite Hafnium Zirconium Oxide for 3D IC Package, Stacked Chip and BSPDN Application
Technology Introduction:
This technology is based on fluorite-structured hafnium–zirconium oxide (HfZrO?) for pyroelectric energy harvesting (PEH). Under thermal gradients, it enables efficient energy recovery through entropy conversion. Leveraging both ferroelectric (FE) and antiferroelectric (AFE) properties, the material also exhibits piezoelectric and pyroelectric effects. Through opposite-polarity electric field cycling, complete fatigue recovery is achieved, significantly extending device lifetime. The goal is to advance its potential applications in 3D packaging, 3D-stacked chips, and backside power delivery network (BSPDN) technologies.
Industry Applicability:
This technology solves the growing heat dissipation challenges caused by continuous scaling in advanced semiconductor processes by developing fluorite-structured hafnium–zirconium oxide (HfZrO?) devices for thermoelectric energy harvesting applications. The material exhibits both ferroelectric and antiferroelectric properties, ensuring high compatibility with advanced process technologies, and demonstrates strong potential for applications with severe heat concentration issues, such as 3D packaging, 3D-stacked chips, and backside power delivery network (BSPDN).
This technology is based on fluorite-structured hafnium–zirconium oxide (HfZrO?) for pyroelectric energy harvesting (PEH). Under thermal gradients, it enables efficient energy recovery through entropy conversion. Leveraging both ferroelectric (FE) and antiferroelectric (AFE) properties, the material also exhibits piezoelectric and pyroelectric effects. Through opposite-polarity electric field cycling, complete fatigue recovery is achieved, significantly extending device lifetime. The goal is to advance its potential applications in 3D packaging, 3D-stacked chips, and backside power delivery network (BSPDN) technologies.
Industry Applicability:
This technology solves the growing heat dissipation challenges caused by continuous scaling in advanced semiconductor processes by developing fluorite-structured hafnium–zirconium oxide (HfZrO?) devices for thermoelectric energy harvesting applications. The material exhibits both ferroelectric and antiferroelectric properties, ensuring high compatibility with advanced process technologies, and demonstrates strong potential for applications with severe heat concentration issues, such as 3D packaging, 3D-stacked chips, and backside power delivery network (BSPDN).
Industrial Applications:
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Contact Information
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Additional Information
Pavilion:Future Tech AI Applications and Industry-Academia Co-op FJ15
Exhibiting Entity:National Science and Technology Council
Application Category:Life Application
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Pavilion:Future Tech AI Applications and Industry-Academia Co-op FJ15
Exhibiting Entity:National Science and Technology Council
Application Category:Life Application