High-Capacity, High-Performance 3D NAND Flash Technology and Product Development
The development focuses on high-capacity and high-layer 3D NAND Flash process technology and products. The three main features of the technical R&D are as follows:
(1) Developing high-layer 3D NAND process technology to increase memory product bit density to 18–20 Gb/mm²;
(2) Developing CMOS components that support ultra-high-speed I/O (3.2 Gbps) to meet PCIe Gen.6 transmission specifications;
(3) Developing ultra-low defect and ultra-high alignment precision hybrid bonding technology to achieve high yield and provide a competitive edge for ultra-high-speed products.
(1) Developing high-layer 3D NAND process technology to increase memory product bit density to 18–20 Gb/mm²;
(2) Developing CMOS components that support ultra-high-speed I/O (3.2 Gbps) to meet PCIe Gen.6 transmission specifications;
(3) Developing ultra-low defect and ultra-high alignment precision hybrid bonding technology to achieve high yield and provide a competitive edge for ultra-high-speed products.
Industrial Applications:
Big data and artificial intelligence rely heavily on data acquisition and processing, making memory bandwidth a major challenge. In the future, memory will evolve from simply storing data to integrating computing capabilities, leading to a new memory-centric computing architecture. This innovative solution can further be combined with logic chips, enabling more diverse application fields. The advanced high-capacity and high-speed 3D NAND technology proposed here can realize this vision and enhance the overall value of the industry chain.
Macronix International . Co., Ltd
Macronix, a leading integrated device manufacturer in the Non-Volatile Memory (NVM) market, provides a full range of NOR Flash, NAND Flash, and ROM products. With its world-class R&D and manufacturing capability, Macronix continues to deliver high-quality, innovative and performance driven products to its customers in the consumer, communication, computing, industrial, automotive, networking and other segment markets.
Macronix was established in 1989 in the Science Park, Hsinchu, Taiwan. Since its inception, Macronix is dedicated to developing top-notch home-grown technologies and improving its manufacturing capability to offer its customers high quality products and services. We have successfully established remarkable strategic alliances and long-lasting relationships with first tier world-class companies. Macronix has also been adhering to high standards of corporate governance, enhancing shareholders' rights and advocating social responsibilities. The Corporate Governance Association awarded Macronix with the CG6002 certification. Macronix was the first semiconductor manufacturer certified with Social Accountability International Standard (SA 8000: 2001) in Hsinchu Science Park.
Macronix continues to emphasize on Research and Development. Our technical papers were published and presented in major international conferences, such as IEDM and ISSCC. Macronix has been granted a large number of high-quality patents and continues its investment in advanced technology development. To provide the next generation of nonvolatile memory solutions, Macronix is in cooperation with its high technology global alliance partners. Macronix also announced the world's first Flash prospective technology, BE-SONOS™.
Macronix is one of the very few suppliers offering a wide range of Serial NOR Flash products from 512Kbit to 2Gbit densities. We also provide Flash products with extremely small packages and very thin packages for space-constrained applications to meet the market trend. In addition, we have launched our 19-nanometer NAND Flash and e•MMC™ product family, which are ideal for embedded applications demanding higher quality and reliability. In our ROM Business, XtraROM® products with 32-nanometer process have been shipping. Macronix also offers a Known Good Die (KGD) program for System In Package (SIP) solutions.
Macronix owns one 12-inch wafer fab (Fab 5) and one 8-inch wafer fab (Fab 2). Macronix designs and fabricates its nonvolatile memory products in Fab 5 & Fab 2.
Looking ahead, Macronix will continue its research efforts in advanced technology development focusing on nonvolatile memory products. We will continue to enhance our technologies, quality and service and dedicate ourselves to obtaining a superior industry position, higher sales growth, steady business operations, in turn increasing Taiwan's global competitiveness.
Macronix was established in 1989 in the Science Park, Hsinchu, Taiwan. Since its inception, Macronix is dedicated to developing top-notch home-grown technologies and improving its manufacturing capability to offer its customers high quality products and services. We have successfully established remarkable strategic alliances and long-lasting relationships with first tier world-class companies. Macronix has also been adhering to high standards of corporate governance, enhancing shareholders' rights and advocating social responsibilities. The Corporate Governance Association awarded Macronix with the CG6002 certification. Macronix was the first semiconductor manufacturer certified with Social Accountability International Standard (SA 8000: 2001) in Hsinchu Science Park.
Macronix continues to emphasize on Research and Development. Our technical papers were published and presented in major international conferences, such as IEDM and ISSCC. Macronix has been granted a large number of high-quality patents and continues its investment in advanced technology development. To provide the next generation of nonvolatile memory solutions, Macronix is in cooperation with its high technology global alliance partners. Macronix also announced the world's first Flash prospective technology, BE-SONOS™.
Macronix is one of the very few suppliers offering a wide range of Serial NOR Flash products from 512Kbit to 2Gbit densities. We also provide Flash products with extremely small packages and very thin packages for space-constrained applications to meet the market trend. In addition, we have launched our 19-nanometer NAND Flash and e•MMC™ product family, which are ideal for embedded applications demanding higher quality and reliability. In our ROM Business, XtraROM® products with 32-nanometer process have been shipping. Macronix also offers a Known Good Die (KGD) program for System In Package (SIP) solutions.
Macronix owns one 12-inch wafer fab (Fab 5) and one 8-inch wafer fab (Fab 2). Macronix designs and fabricates its nonvolatile memory products in Fab 5 & Fab 2.
Looking ahead, Macronix will continue its research efforts in advanced technology development focusing on nonvolatile memory products. We will continue to enhance our technologies, quality and service and dedicate ourselves to obtaining a superior industry position, higher sales growth, steady business operations, in turn increasing Taiwan's global competitiveness.
Contact Information
Name：C.Y. Yang
Tel：03-578-6688#78203
Address：No.16, Li-Hsin Road, Hsinchu Science ParkHsinchu, Taiwan, R.O.C.
Additional Information
Pavilion：Innovation Economy Pavilion Semiconductors IC12
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics
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Pavilion：Innovation Economy Pavilion Semiconductors IC12
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics
