Integrated AiP Packaging Architecture and Materials

•Developed a GaN RF antenna-in-package (AiP) platform for high-frequency communications using heterogeneous integration, Stud Bump, and laser ball placement technologies.

•Achieved >10 dBi gain above 60 GHz, developed low-loss materials (Df=0.0022, CTE=10.7 ppm/°C),

•Published one VLSI paper, obtained 10 patents, and showcased LEO satellite AiP technologies at SEMICON Taiwan 2025.

Industrial Applications:

With the rise of B5G and 6G communications, we developed a 60 GHz AiP solution based on heterogeneous integration and Stud-bump/laser-ball placement technologies. The platform integrates RF chips and antennas in a compact package, achieving over 78% lower thermal resistance than competing solutions. Its 5 GHz bandwidth enables high-resolution sensing for occupant detection, respiration, and heartbeat monitoring, supporting future smart cockpit and automotive sensing applications.

Industrial Technology Research Institute

ITRI is a world-leading applied technology research institute with more than 6,500 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.

Contact Information

Name：KAO HAO-CHE

Tel：0912-950-358

Address：No. 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu County 310401, Taiwan (R.O.C.)

Additional Information

Pavilion：Innovation Economy Pavilion Semiconductors IC05

Exhibiting Entity：Department of Industrial Technology,MOEA

Application Category：Electronics and Optoelectronics

Exhibition