The Development of the Software and Hardware to the Internet of Additive Manufacturing System based on Vat Photopolymerization Technology.
The IoAM system is composed by three components. 1st is the machine hardware integrated by all the mechanical components of a Bottom-Up DLP 3D printer. 2nd element is a web interface which controls and monitors a single or an array of machines from one or multiple operators and devices. 3rd is a firmware, which is responsible to execute the adaptive control for the printing parameters.A cyber-physic manufacturing system for the Bottom-UP type VP based on new technologies,such as Internet of Things (IoT), Cloud Computing, and Big Data Analysis is proposed.The Cloud Computing and Big Data analysis enable to elaborate a monitoring system and a dataset in the cloud of the pulling-up force. The dataset permits to perform an extensive analysis of this phenomenon, in order to create an algorithm to optimize the printing parameters based on geometry of the 3D model to reduce the effects of the separation force. Thus, this algorithm will predict the behavior of the pulling force by defining appropriate values of the printing parameters. As a result, the reliability of this technique will be improve significantly as well as the manufacturing time.The capacity of administering a manifold of 3D printers or a single machine from a singular or multiple stations, devices or operators in a smart factory environment. Besides an adaptive controller for the printer parameters will be implemented.
The Engineering and Technology Promotion Center (ETPC) has been established in 1965 at National Cheng Kung University. It is the exclusive unit continuously supported by the Department of Engineering and Technologies, National Science and Technology Council under projects. The main missions of ETPC are to integrate and promote the academic research achievements, especially in engineering areas to the industry, and to upgrade/add the values of technologies in production development. This center plays an important role as a “bridge” between the academia and industry. In ETPC, an "eTop-Engineering and Technology Open Promotion platform" (www.etop.org.tw) has been established and managed online since 2011. In which, the reports of research projects supported by the Department of Engineering and Technologies, has been digital archived for reference since 2005.
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"1) Integrating AI recognition, IoT, and blockchain into traceable software and hardware for recycling UCO 2) Cutting-edge 3D learning platform powered by Spatial AI 3) Optimize use of existing buildings by making them transformable and adaptive to human needs at the click of a button 4) Non-contact image analysis and calculation technology to capture vital signs through dynamic face detection"
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