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High Entropy Alloy Nitride Hard Coatings Prepared by Cathodic Arc Deposition and Their Applications of Micro End Mills

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High Entropy Alloy Nitride Hard Coatings Prepared by Cathodic Arc Deposition and Their Applications of Micro End Mills

The technology uses cathodic arc deposition combined with electromagnet field control and optical emission spectroscopy (OES) for the deposition of new functional high entropy alloy (HEA) nitride coatings. The HEA nitride coatings possessed such high hardness and excellent hydrophobicity with low surface energy which are beneficial for high speed dry cutting. Finally, the coatings were deposited on the micro end mills for cutting test of printed circuit board. The HEA ACZN coated tools can possess high wear resistance and outperform the uncoated tools at least 4 times of tool lives.

The technology uses cathodic arc deposition combined with new electromagnetic field control and optical emission spectroscopy (OES) for the deposition of new functional high entropy alloy (HEA) nitride coatings. The HEA AlTiSiCrVZrN coating has combined with high entropy alloy and nanolayer structure features. These characteristics make the coating possessing outstanding mechanical properties and excellent hydrophobicity that are beneficial for high-speed dry cutting of PCB materials while improving adhesive wear resistance.

The technology uses cathodic arc deposition for the deposition of new functional high entropy alloy (HEA) nitride coatings on the micro end mills for cutting test of printed circuit board. The HEA coatings has new features combined with high entropy alloy and nanolayer structure features. These characteristics make the coating has outstanding mechanical properties and excellent hydrophobicity that are beneficial for high speed dry cutting while improving adhesive wear resistance. This technology has the prospect and competitiveness to improve machining quality by tool coatings.

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https://tievirtual.twtm.com.tw/iframe/2eb9cbfb-1557-4195-b2f1-f2e63bb7aaac?group=23bfb1fa-dd5b-4836-81a1-4a1809b1bae5&lang=en

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  • Name:張銀祐

  • Phone:03-5715131分機35372

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  • Pavilion:Future Tech Semiconductor block

  • Affiliated Ministry:National Science and Technology Council

  • Application Field:Materials & Chemical Engineering & Nanotech

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  • Technology maturity:Experiment stage

  • Exhibiting purpose:Product promotion、Display of scientific results

  • Trading preferences:Technical license/cooperation、Negotiate by self

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