Technology Introduction:
A single-die testing system using the B1505A evaluated probe landing position, repeated contacts, scratch length, and triboelectric charging, improving measurement accuracy and efficiency. Devices underwent short-circuit tests, with LTSPICE and TCAD simulations analyzing temperature-induced failure mechanisms, followed by optical and SEM failure analysis.
Industry Applicability:
The High-Power Device Testing System maps electrical characteristics across a bare die to determine the optimal probe position. LTSPICE models predict short-circuit I-V behavior and internal temperatures to identify device limits. Industrial adoption can improve bare-die testing accuracy and efficiency and anticipate packaged device performance, preventing damage.