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3D-Stacking Integrating Logic and Memory Chips - Provide industry-leading logic and memory one-stop design and value-added services. - Compared with the traditional architecture, the bandwidth is increased by more than x10, and the energy consumption of data movement is reduced to less than 1/10 Expand the high-value and emerging business opportunities for the DRAM industry - The ten-fold acceleration technology of AI computing meets the high-speed computing needs from cloud to edge. - The entire AI computing circuit will be miniaturized to the millimeter level, which is suitable for metaverse, virtual reality and various micro smart product applications.
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsFrom 3D x 2D computer vision image processing chips and related applications, with its 3D image processing controller ICs as the core, including binocular 3D stereoscopic image processing ICs, it produces a hardware and software development platform for AI/ML machine vision, fully meeting the requirements of AGV/AMR. The products are designed to be lightweight, compact, and easy to integrate, not only reducing costs but also facilitating rapid development and mass production for developers and manufacturers. This is a significant advantage for startups and system manufacturers interested in developing computer vision products.
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsA I Memory is invested by the Powerchip Group, focuses on IC design services based on PSMC's AI-in-Memory (AIM) technology. We develop 3D Wafer-on-Wafer processes, fusing logic with DRAM to accelerate memory efficiency. In collaboration with PSMC, we establish a design flow for 3D AI ICs, promoting applications in fields like ADAS and IoT.
Innovation Pilot | Electronics & Optoelectronics/Information & Communications"DeCloak Intelligences released a PPU (privacy processing unit) chip which has evolved into a USB format PPU-Dongle based on the core technology of differential privacy. This technology can randomly add an amount of noise to destroy identifiable segments of data while maintaining high efficiency of data anlysis to achieve de-identification. Data is transferred in a de-identified format to the back-end or to cloud, allowing businesses to utilize DeCloak Intelligences' AI prediction model to perform big data analysis or reconstruct big data trends."
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsTo meet emerging customer needs and environmental requirements, Etron also provides a full lineup of green DRAM products in accordance with the Restriction of Hazardous Substance (RoHS) Directive. Etron’s high-standard specialty buffer memory has the most complete SDR / DDRx (DDR1, DDR2, DDR3, DDR3L and DDR4) capacities and solutions, from 16Mb, 32Mb, 64Mb, 128Mb, 256Mb, 512Mb, 1Gb, 2Gb, 4Gb and 8Gb all readily available. Etron is the leading brand of DDR1/2 memory in the Greater China market and also a major international supplier of DDR3 memory products.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsShowcasing a full range of 3D vision modules, coupled with an exclusive SDK development kit for on-site implementation, including features like 3D image recognition and gesture recognition. We also offer compatibility with Google's released MediaPipe for real-time image tracking and other functions, bringing AI closer to daily life. Among them, the G53 is the world's smallest 3D binocular vision module, with module dimensions of only 5.0 cm (length) x 1.5 cm (width) x 2.0 cm (height). It is particularly suitable for close-range, high-precision depth measurement, providing centimeter-level depth resolution capabilities.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsVIS is committed to green manufacturing and environmental sustainability, and the research and development of process technology including high-voltage, power analog BCD, ultra-high voltage and gallium nitride technology platforms continue to move towards low power consumption and high efficiency. This will make end application products of our customers, such as computer, communications, consumer, industrial, and automotive products, meet high efficiency and power-saving standards. VIS will continue to expand the Company's green influence.
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsApplication specific buffer memory KGD (known good die) offers consumer electronics the benefits of reduced system costs and smaller physical volume, as well as meeting performance requirements in terms of low power consumption and high-speed data transfer, and minimizing EMI (electromagnetic interference). With extensive experience in KGD products, Etron has been a valued partner to many leading semiconductor and system customers worldwide.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsEtron’s innovative KOOLDRAM® can extend the retention time of DRAM substantially under the JEDEC standard, which is best-fit for high-temperature applications, such as automotive or KGDM, and brings significant improvements of overall DRAM performances.
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsDeepMentor is a company that provides customers with the best AI IP (Silicon Intellectual Property) solutions and custom AI IP design services. We address the fast-growing demand for chip customization in the Edge AI market. Our patented miniaturization technology and automated AI IP design tools, DeepMentor, can convert large language models (LLMs) and other cloud AI algorithms into chip circuit operations, reducing algorithm complexity and data movement by 90% while maintaining a model accuracy drop of less than 1%. We successfully retain the advantages of Cloud AI in our AI IP solutions.
Innovation Pilot | Electronics & Optoelectronics/Information & Communications3D-Stacking Integrating Logic and Memory Chips - Provide industry-leading logic and memory one-stop design and value-added services. - Compared with the traditional architecture, the bandwidth is increased by more than x10, and the energy consumption of data movement is reduced to less than 1/10 Expand the high-value and emerging business opportunities for the DRAM industry - The ten-fold acceleration technology of AI computing meets the high-speed computing needs from cloud to edge. - The entire AI computing circuit will be miniaturized to the millimeter level, which is suitable for metaverse, virtual reality and various micro smart product applications.
Innovation Pilot | Information & Communications/Electronics & Optoelectronics"The Innolux Naked-eye N3D Real-Time Interactive Photography is a top-tier innovative product that combines Innolux's exclusive naked-eye 3D display technology with advanced AI algorithms. What sets it apart is its ability to rapidly transform flat photos into stunning 3D images in just 30 seconds, creating an entirely new 3D photography display screen experience. The Innolux Naked-eye N3D Smart AI display heralds a new era of visual experiences, redefining how people appreciate and interact with cherished memories."" transform flat photographs into stunning 3D stereoscopic images in a mere 30 seconds, revolutionizing the way we experience 3D photography on display screens. The Innolux N3D Digital Photo Frame redefine how people cherish and interact with their cherished memories. With Innolux N3D Digital Photo Frame, a whole new dimension of immersive ways of appreciating memories is unlocked."
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsPhison X1 is a next generation better enterprise-class SSD controller, which will help enterprise application reduce total cost ownership(TCO) through increased storage density, lower power consumption, and higher performance. Phison focus on to serve the broad performance-driven enterprise SSD market while continuing our leadership in the enterprise SSD controller with Phison's advanced ASIC technology, coupled with engineering excellence. PS5020-E20 is going to fulfill the requirement from High performance computing, hyperscale data center, and artificial intelligence application. Based on Phison ASIC technology and storage experience, X1 could fit specific workload, any unique environment, generic application, including cloud storage, 5G edge computing, and super computing, and provide the best in class experience for enterprise customer.
Innovation Pilot | Information & Communications/Electronics & Optoelectronics1. MPI Probe Card division provides a wide range of solutions to the semiconductor wafer level test market. Leveraging our global operations and localized service advantages, we provide customers with a one-stop testing solution. Integrated Circuit (IC) applications include Driver, Logic, CIS, RF. Our applications primarily come from customers with testing needs in high-speed computing areas such as artificial intelligence (AI), data centers, 5G, and automotive electronics. 2. AI, 5G, and HPC are important areas for the future development of high-end technological applications in Taiwan's PCB industry. This product's PCB semi-automatic inspection equipment is equipped with an adjustable probe device to meet the diverse spacing measurement needs of customers, providing comprehensive product inspection services to ensure the quality of signal transmission. Simultaneously, it features an electrical self-inspection mechanism to check equipment accessories, ensuring inspection quality and providing customers with accurate measurement results.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsRealtek brings you an Automotive Total Solution ranging from Automotive SoC, Display, and Audio ICs all the way to fast and reliable Ethernet, Wi-Fi, and Bluetooth. Realtek’s Automotive Total Solution will dramatically increase the intelligence of your car, giving you a more advanced and pleasurable driving experience.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsRPC DRAM® offers system users unique and valuable advantages. It adopts a wafer-level chip size package (WLCSP, a fan-in wafer-level die-scale package) that is the world's first high-bandwidth DRAM offered in a WLCSP. The x16 256 megabit RPC DRAM, has half the number of pins compared to similar bandwidth DDR3 products, and only needs 1/10 the PCB area. Thus, it can provide a path to both miniaturization and cost reduction.
Innovation Pilot | Electronics & Optoelectronics/Information & CommunicationsIntelligent Transparent AI Translation Counter - This product offers high transparency and uniformity. Unlike traditional PDLC technology, it provides high-performance LCD glass windows for architectural use. It offers instant switching between transparent and frosted states, customizable sizing. In frosted mode, it functions as a privacy screen, and when paired with a projector, it offers rear projection capabilities with superb image quality. In transparent mode, it provides exceptionally high transparency rates. Combining AI and motion-sensing technology, it serves as an instant translation system and projector, transforming into a transparent display to show real-time text translation information. Applications include airports, travel counters, museums, art galleries, clinics, etc., providing real-time multilingual services
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsThrough the integration of 3D sensing and computer vision modules, this system can analyze the coordinates of individuals, maintain a fixed distance while following them, and identify objects to avoid obstacles. In addition, it provides position information (XYZ coordinates) to enable the robot to generate an environmental map and determine its own position within the map in unknown environments. This successful implementation of the 3D depth module has been applied to automated and intelligent applications such as following hand carts in production.
Innovation Pilot | Information & Communications/Electronics & OptoelectronicsComing soon!