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The acoustic vortex light guide tech uses ultrasonic waves to form bubble structure for non-contact, dynamic control, reversibility, and reduced light scattering. By employing acoustic vortices, it minimizes tissue scattering, increasing light fluence by about 34.3%. Simple to operate, non-invasive, and lowering tissue damage risks, it offers a novel solution for biomedical optical diagnostics and therapy.
Future Tech | Electronics & OptoelectronicsThis chip achieves integrated functions for microfluidic operations, temp control, and capacitive sensing. Compared to PCB devices, this chip can integrate with systems through software, automatically sensing conditions and flexibly generating and manipulating different patterns according to various objectives, thus lowering the operational threshold. The device is small in size and low in cost ($0.1 per chip) and has already been practically applied in bio-detection experiments such as LAMP.
Future Tech | Electronics & OptoelectronicsDSRP is a 0.3U payload designed to be mounted to the exterior panel of the ispace Hakuto-R lunar lander. The payload contains a controller board, processing element, embedded software, radiation sensitive field effect transitor dosimeter, and Flash memory that is used for data storage and detection of single event upset bit flips. The payload chasis provides protection from the severe thermal environment using a radiator and multi-layer insulation, new technology developments for deep space.
Future Tech | Electronics & OptoelectronicsThe technology combines memory devices, in-memory computing, and simulated annealing algorithms to create the world's first in-memory annealing unit (IMAU). First verified on 10-city traveling salesman problem and 300-read genome assembly, it is expected to be 1000 times faster than current hardware. It serves as a potential tool for high-speed optimal decision-making in chip design, biomedicine, and logistics, presented at IEDM 2021 and awarded first place in the 2024 Micron MIMORY Award.
Future Tech | Electronics & OptoelectronicsThe Micro-Detector Array (MDA) aims to monitor the uniformity of dosage in various processes, including EUV, DUV, e-Beam, and Ion-Beam. The MDA is capable to measure critical dimensions, image log slope, and pattern edge location. Meanwhile, MDA is fully compatible with logic process, which provides advantages of high contrast in intensity, wide dynamic range, built-in calibration, and instant WAT analysis. These features enable the MDA to monitor process parameter variation.
Future Tech | Electronics & OptoelectronicsThis technology is a rapid food safety screening SERS chip with high sensitivity, stability, uniformity, and reproducibility. It addresses the current market gap for a reliable SERS chip solution. In food safety applications, it has achieved LOD for melamine down to 0.05 ppm and bisphenol A down to 1 ppb, both below regulatory standards. Additionally, it can detect preservatives, antibiotics, Sudan red, and natural food. The technology has also been patented and recognized in academic journals.
Future Tech | Electronics & OptoelectronicsExisting ALD techniques fail to address the issues of residual voids and seam defects in trench filling. We have developed a photo-induced precise ALD (LIP-ALD) technique over the past decade, which enables precise control of atomic deposition for gap fills. It has achieved seamless, pore-free, and low-impurity dielectric material deposition in high aspect ratio N3 and N2 node structural wafers. AMAT, AL, and TSMC have co-joined the research of this novel LIP-ALD process in NTHU with our team.
Future Tech | Electronics & OptoelectronicsUsing a self-developed optimization algorithm, we designed and fabricated Taiwan's first 2 cm thermal imaging metalens with a 60° field of view, aberration correction, and broadband achromatic performance (8-12 μm). This lightweight, 1-gram metalens is ideal for drones and aerospace, addressing reliance on imports and enhancing national security.
Future Tech | Electronics & OptoelectronicsWe employed an atomic vapor cell, a practical component, to develop the source of biphoton quantum light. For the first time, we utilized the all-copropagation scheme and developed a high isolation technique. The source's linewidth and spectral brightness are the world records to date. It has a stable frequency with a wide adjustable range, a highly tunable linewidth compatible with various quantum devices, and ultrahigh brightness, leading to a key apparatus in the future quantum communication.
Future Tech | Electronics & OptoelectronicsFor the first time, we use a single PCSEL as a light source, directly projected onto a designed holo-patterned metasurface. This results in a structure 233 times smaller than an iPhone's, without needing a lens system. This architecture, homogeneously integrated with photonic crystal lasers, reduces power consumption by 10.8 times compared to conventional systems. This innovation achieves miniaturization, lightweighting, and energy saving, making it easier to integrate into AR/VR systems.
Future Tech | Electronics & OptoelectronicsConductive 2D materials as low-contact-resistance electrodes → MoS2(下標) transistors with all 2D material interfaces. van der Waals epitaxy of 2D materials → quantum-dot light-emitting diodes and bifacial solar cells with thin metal/2D material transparent electrodes. Resonant plasmonic nanostructures → ultrathin phototransistors with ultrahigh responsivity Wafer-scale and multi-layer 2D materials → photovoltaic vertical devices and photoconductive planar photodetectors with shortened response times
Future Tech | Electronics & OptoelectronicsComing soon!