The original technology developed is based on generation of plasma-cluster flow emerging from cathode spots and is used for deposition of new types of comparatively thick metallic coating materials in homogeneous or/and layered structures.

The coatings and coating materials feature:

• Coatings from 20 to 300 microns in thickness.


• Uniform fine-grain structure and absence of column structure.


• High deposition rate and low power consumption.


• High productivity - deposition rate of 1-5 microns per minute.


• Possibility to predetermine and control material structure of the coating / film.


• Complex cathodes made of two and more metals enable production on intermetallic materials.      


• Possibility to put thick film also on ceramic materials.


• Easy to install our evaporator into existing vacuum production lines.


• Detached film material in 20-300 microns thickness.


• Clean and environment-friendly technology.

The technology opens new possibilities for various applications:

1. Coatings and films in various metals, including refractory (Zr, Ta, Ti, Mo, etc) and their combinations for corrosion, wear and other protection.

2. Possibility to produce coated sheet and rolled metal as well as its arc-cleaning in order to replace picking technologies.

3. Possibility to obtain multilayered structures, say, for X-ray protection (W+Cr+Ti +Al structures) and power electronics.

4. Possibility to obtain new Low Temperature Superconductive Nb, NbTi, NbGe films with very high values of the critical current density as well as very good mechanical properties for further processing to manufacture superconducting cables in a simple and inexpensive way.

Thus the implementation of the technology will enable to obtain new materials with preset and controlled properties, to replace contaminating galvanic processes, reduce costs for some techniques, open up new potential for industry and reduce energy consumption.