This system provides accurate dimensional measurements of 300mm wafer FOUP/FOSB. Automation includes FOUP/FOSB loading and simultaneous loading of 25 wafers, with measurements taken with the lid open and closed. It measures outer diameter, wafer protrusion, and all 25 wafer pitches. High-precision imaging using our optics allows for the measurement of diverse FOUP/FOSB/OC types, including non-standard 300mm and colored units. This ensures stable, repeatable measurements for enhanced quality control in semiconductor manufacturing.