The novel Insulation material and CMP slurry realizes excellent adhesion and reliability with high-quality hybrid bonding.
* CMP slurry that achieves both superior flatness and processing speed
* Insulation material has the following features;
1. High adhesion in bonding process
2. No crack and delamination in reliability test
3. Heat dissipation ability
技術成熟度:實驗室階段
展示目的:可交易技術、商機推廣
流通方式:專利授權/讓與
敬請期待!