Wafer-level Low-warpage Multi-layer Bonding Technology
With growing demand for high-frequency, high-density heterogeneous integration, advanced packaging (2.5D/3DIC, Chiplet, FOWLP) requires high-precision, low-warp multilayer RDLs. Traditional RDLs induce thermal stress, causing warpage. A low-warp Cu/polymer multilayer bonding process—using low-CTE materials like nano Cu (Nc-Cu), PI, PBO, and stress compensation design—minimizes stress. With ?200°C and 1.06 MPa for 1 hour, multiple Cu/polymer layers can be stacked. This enhances precision and supports AI, 5G, and autonomous chip integration.
Industrial Applications:
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Industrial Technology Research Institute
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Contact Information
Name：Arthur Chiu
Tel：(03)5914094
Address：195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C.
Additional Information
Pavilion：Innovation Economy Semiconductor IC23
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Information and Communications、Life Application
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Pavilion：Innovation Economy Semiconductor IC23
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Information and Communications、Life Application
