As Moore’s Law slows, heterogeneous integration has become essential for boosting system performance and functional density. Advanced packaging now plays a central role in enabling such integration. This study develops Through-Glass Via (TGV) technology, highlighting innovative wet metallization and high-aspect-ratio electroplating processes pioneered by ITRI. These methods effectively address the adhesion and filling challenges of PVD in deep vias, offering a practical, scalable solution for next-generation heterogeneous packaging.