Digital Dynamic Correction Applied to Low Warpage Panel Level Package
To meet future demands for high-speed IC computation, a 4-layer Redistribution Layer (RDL) has been developed. This RDL integrates maskless digital patterning and low-temperature sputtering technology to achieve high resolution (2μm) and low warpage (less than 0.2mm@37X47 cm2). It is suitable for high-end panel-level advanced packaging applications.
Industrial Applications:
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Industrial Technology Research Institute
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Contact Information
Name：Terry Wang
Tel：(03)5912570
Address：195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C.
Additional Information
Pavilion：Innovation Economy Semiconductor IC19
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics
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Pavilion：Innovation Economy Semiconductor IC19
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics
