TGV Laser Drilling and Metallization Technology with High Aspect Ratio
ITRI has developed advanced laser drilling technology for TGV interposers, integrating an ultrafast laser, a self-developed adjustable optics module, and a fluorine-free etching process. This enables substrate processing with aspect ratios up to 25, meeting high-density and high-I/O demands for 3D IC packaging. Compared to mechanical drilling, it boosts speed, reduces tool wear, and cuts carbon emissions by over 40%.
Industrial Applications:
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Industrial Technology Research Institute
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Contact Information
Name：Chien-Jung Huang
Tel：(06)6939-007
Address：No. 8, Gongyan Rd., Liujia Dist., Tainan City 734045, Taiwan (R.O.C.)
Additional Information
Pavilion：Innovation Economy Semiconductor IC14
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics、Materials, Chemical Engineering and Nanotech
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Pavilion：Innovation Economy Semiconductor IC14
Exhibiting Entity：Department of Industrial Technology,MOEA
Application Category：Electronics and Optoelectronics、Materials, Chemical Engineering and Nanotech
