Photolithography plays a dominant role in global high-technology industry. Conventional UV exposure methods are mostly using photomasks, which can be time/cost-consuming ad lack the manufacturing flexibility. In recent years, due to the digital light processing (DLP) technology developed by TI company, maskless lithography UV exposure systems are emerging quickly and are gradually replacing conventional UV exposure methods. However, the maskless UV exposure systems on the market now are all dominated by foreign companies (Germany, Japan, and China, for example), and there is no domestic company in Taiwan which is capable of developing her own maskless lithography system. This poses a serious threat and challenge to Taiwan’s electronics industry. This project aims at developing a high-resolution maskless lithography system with a smallest patterning linewidth down to 5~10 um. It is because we are going to adopt a new design of UV patterning method based on the concept of “aspheric microlens array, UV point array, and obliquely scanning scheme”, which allows extremely fine pattern resolution with similar UV energy efficiency at the same throughput. Based on our proprietary designs and components, the performance of this new type of maskless lithography system can quickly exceeding its competitors on the market and creates its own market share.