A novel metallization overcomes these challenges. In combination with Al thick film processes and chemical replacement reaction consisting of nickel, copper can be applied to many different cell structures such as P-type or N-type, BSF solar cell，PERT bifacial solar cell. This novel metallization technology would be conducted to both the existing Al electrode and the existing Ag electrode for solar cells with the rear and front electrodes.The team developed for many years to use thick film printing to make aluminum electrodes, and then use the high oxidation potential of the aluminum electrode itself to soak the sintered thick film aluminum electrode in various metal solutions with lower oxidation potential to adjust the appropriate solution. Various metals and alloys can be obtained by temperature, pH value, and immersion time. This technology overcomes the problem that base metals or alloys that are generally easy to oxidize at high temperatures can only be synthesized under extremely high temperatures and must be reduced in the atmosphere.Using the novel metallization technique, the existing noble metal Ag applied to solar cells would be replaced by base metal Cu. It would make the cost and efficiency of the exiting solar cell greatly improved.