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Investigations of probes for the applications in the high frequency and high speed IC testing system

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Investigations of probes for the applications in the high frequency and high speed IC testing system

This project is to 「investigate the probes for the applications in the high frequency and high speed IC testing system」. We would design three different types of probes for high frequency and high speed IC testing system, including pitch 0.3, 0.4, and 0.8mm. We use the Agilent’s Advanced Design System software to simulatie of three different types of probes for high frequency and high speed IC testing system.The tests of the semiconducting devices can be divided into the chip probe (CP, test before package) and final test (test after package). The wafer level chip scale package (WLCSP) is one kind of CP and it has the merit of reducing the package size, which can match the market development. This investigated technology is to 「investigate the probes for the applications in the high frequency and high speed IC testing system」.The tests of the semiconducting devices can be divided into the chip probe (CP, test before package) and final test (test after package). The wafer level chip scale package (WLCSP) is one kind of CP and it has the merit of reducing the package size, which can match the market development. This project is to 「investigate the probes for the applications in the high frequency and high speed IC testing system」.

Engineering And Technology Promotion Center

The Engineering and Technology Promotion Center (ETPC) has been established in 1965 at National Cheng Kung University. It is the exclusive unit continuously supported by the Department of Engineering and Technologies, National Science and Technology Council under projects. The main missions of ETPC are to integrate and promote the academic research achievements, especially in engineering areas to the industry, and to upgrade/add the values of technologies in production development. This center plays an important role as a “bridge” between the academia and industry. In ETPC, an "eTop-Engineering and Technology Open Promotion platform" (www.etop.org.tw) has been established and managed online since 2011. In which, the reports of research projects supported by the Department of Engineering and Technologies, has been digital archived for reference since 2005.

Contact

  • Name:楊證富

  • Phone:07-5919283#7283

  • Address:No.1, Ta-Hsueh Road, Tainan 701, Taiwan.

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  • Pavilion:Future Tech

  • Affiliated Ministry:National Science and Technology Council

  • Application Field:Materials & Chemical Engineering & Nanotech

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  • Technology maturity:Trial production

  • Exhibiting purpose:Technology transactions、Product promotion、Display of scientific results

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