The heat dissipation of electronic components becomes one of the most critical technologies for the developments of IoT, IoV, and 5G mobile communications. Implantation of heat dissipation components inside electronic products is of practice important to the 5G communication products today. Herein, we established:
1. High-speed and pulse-reverse electroplating methods for the fabrication of heat dissipation components.
2. Microstructure modification of Cu interconnects for fine line technology and 5G high-frequency/-speed transmission interconnect design.

1. The heat dissipation components were successfully embedded in PCB via the pulse-reverse, high-speed Cu electrodeposition method, which greatly increase the throughput of electrodeposition and 5G heat dissipation efficiency.
2. The Cu microstructure can be well modified to meet the requirements of fine lines and 5G high-frequency transmission.

1. Through the simulation platform (COMSOL Multiphysics and ANSYS-HFSS), we enabled to greatly increase the fabrication throughput of heat dissipation components for 5G high-frequency PCB and automotive PCB.
2. Through the Cu microstructure modification, the mechanical reliabilities of fine lines and high-frequency transmission can be greatly improved.

線上展網址：
https://tievirtual.twtm.com.tw/iframe/7758d4e3-66e2-4892-af42-5220bf6130c4?group=23bfb1fa-dd5b-4836-81a1-4a1809b1bae5&lang=en