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Antenna-in-package (AiP) Technology Suitable for Feeding to the Smart Impedance Material for High-Gain Radiations at Millimeter Wave Frequencies

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Antenna-in-package (AiP) Technology Suitable for Feeding to the Smart Impedance Material for High-Gain Radiations at Millimeter Wave Frequencies

mmW 5G/B5G/6G and LEO satellites use large active antenna arrays of more than 1000 elements. A number reduction aided by low cost intelligent panels is developed to reduce at least 60% cost. AiP and AiM are used to compact the array with reconfigurability at low power losses. The gains are compensated by phase-reconfigurable AiP/AiM to feed smart multi-beam panels of large apertures. It may steer directional beams by operating the active RF modules tightly fed by AiP/AiM based arrays. Tile architecture can be implemented using multiple AiPs/AiMs for flexible array configurations.
mmW Radio systems use large antenna arrays for high gains. The complexity and cost of active modules hesitates the applications. A hybrid of small AiP/AiM-based arrays, and a smart material panel to reduce the fabrication cost. The AiP/AiM technologies retain high power efficiency at small sizes, and dynamic steering with focusing functionality. The smart material-based panels provide sufficient aperture size to increase gain, and power focusing. This combination reduces the system complexity by 60%. The array reduces the cost by 80% to form AiP/AiM compared to the Starlink’s solution.
An “AiP+Smart material panel” is developed. The AiP/AiM compacts antennas and active RF devices into a system module with low power losses and high stability of beam reconfigurability. The smart panel increase antenna gains. We realized the AiPs at 5G mmW bands, applicable to ground stations in various applications including handheld devices, mobile terminal devices, Internet of Things (IoT) links, or home-center for wireless links between peripheral equipment, and CPE high-gain antenna system of front and back haul networks.

線上展網址:
https://tievirtual.twtm.com.tw/iframe/97bbbd9a-820b-4cad-81f5-df9c6561d8e7?group=23bfb1fa-dd5b-4836-81a1-4a1809b1bae5&lang=en

Contact

  • Name:Lin, Szu-Hua

  • Phone:02-33661893

  • Address:10617 臺北市羅斯福路四段一號

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  • Pavilion:Future Tech Semiconductor block

  • Affiliated Ministry:National Science and Technology Council

  • Application Field:Electronics & Optoelectronics

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  • Technology maturity:Prototype

  • Exhibiting purpose:Product promotion、Display of scientific results

  • Trading preferences:Negotiate by self

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