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High breakdown voltage HEMT device

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High breakdown voltage HEMT device

The epitaxial layer structure of the GaN-on-Si substrate was improved, and the HEMT device fabrication process was optimized to achieve a GaN HEMT device with a breakdown voltage of >1200V

National Yang Ming Chiao Tung University

學研單位

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  • Address:No. 75, Boai Street, Hsinchu 300, Taiwan, ROC

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  • Pavilion:Future Tech Semiconductor FB19

  • Affiliated Ministry:National Science and Technology Council

  • Application Field:Materials & Chemical Engineering & Nanotech

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  • Technology maturity:Experiment stage

  • Exhibiting purpose:Display of scientific results

  • Trading preferences:Negotiate by self

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