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3D IC Design with Multiphysics In-Design Analysis

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3D IC Design with Multiphysics In-Design Analysis

As electronic systems have grown incrementally more complex, the path to success in today’s highly competitive electronics markets has moved to a practice called "shift left." This allows design teams to find and prevent defects early in the 3D-IC design process/workflow to improve electronic product and system quality and performance by moving engineering tasks to the left as early in the lifecycle as possible. Cadence provides complete and comprehensive solutions enabling 3D-IC designs to uncover and address problems earlier in the design cycle using multiphysics in-design analysis technologies.

Cadence Design Systems, Inc.

Cadence成立於1988年,在運算軟體領域擁有超過30年的經驗,是當今電子設計的領導者。公司以智慧系統設計(Intelligent System Design)為核心策略,提供軟體、硬體及半導體IP,協助電子設計從概念走向應用實現。Cadence服務全球客戶,從晶片、印刷電路板至整體系統打造尖端與創新的電子產品,以應用於行動、消費性電子、超大型運算、5G通訊、汽車、航太、工業及健康醫療等當今最活躍的市場。Cadence是業界唯一能提供從系統設計所涵蓋的積體電路(IC)、封裝與電路板間無縫設計全流程解決方案的電子設計自動化(EDA)公司,30多年來持續驅動半導體創新。

Contact

  • Name:Julian Sun

  • Phone:03-566-3730

  • Address:

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  • Pavilion:Innovation Pilot International Exhibitors IH15

  • Affiliated Ministry:Department of Industrial Technology,MOEA

  • Application Field:Information & Communications

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  • Technology maturity:Others

  • Exhibiting purpose:Patent transactions、Product promotion

  • Trading preferences:Negotiate by self

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