Through combining thermo-sensitive and laser-sensitive materials, pattern designs, and mechanism designs of adhesives as well, we are the first to develop a dry patch that can initiate fast adhesion responses under laser irradiation. It has the characteristics of residue-free, high adhesion, and easy peeling, being suitable for somewhere needed controllable adhesions, and can be applied to wet and rough object surfaces. The advantage of rapid response is very suitable for temporary fixation and assembly handling of wafer and chip processing, and can be used in semiconductor manufacturing, electronic assembly, and optoelectronics process, etc.