e.g., Technology Specifications, Improvement & Advantages, related applications & end products, marketing analysis, etc.


*High Speed / High Density Mounting of BiTe chips used practically on flexible and thin substrate　→Low Cost
*Flexible Structure to fit any round surface →High Performance

*High Heat Recovery Ratio (about 3 times higher than conventional)
*High Thermoelectric Conversion Efficiency (about two times higher than conventional)
*Low Cost and High Reliability, owing to the mature semiconductor manufacturing technology
*Various TEG Chips can be used for the module