<Novelty; Unique Module Structure>

*High Speed / High Density Mounting of BiTe chips used practically on flexible and thin substrate　→Low Cost

*Flexible Structure to fit any round surface →High Performance

<Feature>

*High Heat Recovery Ratio (about 3 times higher than conventional)

*High Thermoelectric Conversion Efficiency (about two times higher than conventional)

*Low Cost and High Reliability, owing to the mature semiconductor manufacturing technology

*Various TEG Chips can be used for the module