Monolithic 3DIC Process Service Platform (Novel 3D DRAM Architecture)
Technology Introduction:
Co-developed by TSRI and Macronix, this novel 3D Dynamic Random Access Memory (3D DRAM) architecture provides a high-bandwidth and high-density memory solution specifically designed for Artificial Intelligence (AI) chips.
Industrial Applications:
This technology demonstrates strong international competitiveness, with its development leading major industry players in Japan, the United States, and South Korea. This achievement highlights Taiwan’s leading position in next-generation memory technologies and further strengthens its strategic position in the global AI chip landscape.
National Applied Research Laboratories
The main missions of NIAR are:
To establish R&D platforms
To support academic research
To promote frontier science and technology
To foster high-tech talent
To establish R&D platforms
To support academic research
To promote frontier science and technology
To foster high-tech talent
Contact Information
Name：Chih-Chao Yang
Tel：03-577-3693 #7565
Address：No.26, Prosperity Road I, Hsinchu Science Park, Hsinchu 300091, Taiwan, R.O.C.
