Chip-Level Advanced Packaging & Heterogeneous Integration Platform
Technology Introduction:
TSRI’s chip-level advanced packaging technology combines 2.5D interposers, 3D stacking and chiplet-based heterogeneous integration. It integrates computing, memory, silicon photonics, sensors and high-speed interfaces in one package, enabling high performance, low power consumption and flexible system design.
Industrial Applications:
Applicable to AIoT, 5G and high-frequency communications, automotive electronics, smart healthcare, silicon photonics and quantum computing. An open design and verification platform can lower entry barriers for academia and startups, accelerate commercialization and strengthen Taiwan’s system-integration capability.
National Applied Research Laboratories
The main missions of NIAR are:
To establish R&D platforms
To support academic research
To promote frontier science and technology
To foster high-tech talent
To establish R&D platforms
To support academic research
To promote frontier science and technology
To foster high-tech talent
Contact Information
Name：Po-Chang Wu
Tel：06-208-2408 #8218
Address：7F, Chimei Building, Tzu-Chiang Campus, No.1, University Road, Tainan City 701401, Taiwan, R.O.C.
