The technology of the invention patent is concerned a packaging structure, particularly a kind of package that can improve the uniformity of the light source, for uniform lighting and its application to backlight modules. The package is composed with a multi-side transparent body that its upper side and peripheral sides are planes; however, on the bottom side there has an inward half-spherical cave. Through the above structure, the light pattern and energy of a light-emitting diode can be redistributed as the diode is covered against the cave of the transparent package so that a uniform lighting structure of high brightness, high efficiency, and high uniformity can be obtained. Meanwhile, if one or multiple arrays of the invented uniform lighting structure are used to compose a backlight module, the uniformity of the panel can be improved.