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Programmable Packaging Platform With Micro-AI 4D-SiP Solution For Future Autonomous Drone

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Programmable Packaging Platform With Micro-AI 4D-SiP Solution For Future Autonomous Drone

ITRI's 4D-SiP integrates a patented multiplexed IO system for UAVs. This design is based on the 4D Programmable Packaging Platform, which integrates AI and multiple sensors to create a highly robust AI-UAV system. The miniature 4D-SiP supports High-Mix Low-Volume (HMLV) micro-AI applications, and its architecture allows the SiP package IO to be dynamically programmed to meet various product requirements. The 4D-SiP platform is compatible with traditional Raspberry Pi and Arduino, enabling these EVBs to be upgraded beyond state-of-the-art.

Industrial Technology Research Institute

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.

Contact

  • Name:Jerry Wang

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  • Address:195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C.

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  • Pavilion:Innovation Pilot Discovering Technology Treasures IF08

  • Affiliated Ministry:Department of Industrial Technology,MOEA

  • Application Field:Electronics & Optoelectronics

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  • Technology maturity:Prototype

  • Exhibiting purpose:Display of scientific results

  • Trading preferences:Negotiate by self

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