As the component density and operating frequency of ICs continue to increase, probe cards for testing require finer probes. The metal probes of traditional probe cards have low strength, making it impossible to make ultra-fine probes, and the probes are long, which is not conducive to high-frequency (>6 GHz) testing. The assembly is all done by hand one by one. High-strength and high-density probe card technology, innovative development of "high-strength micro-cantilever probe module" and "3D ceramic circuit board": can make ultra-fine probes with a needle diameter of <20 µm; can assemble hundreds of probes at a time, Instead of manual pin-by-pin assembly; it can meet high-frequency test requirements (>6 GHz).This technology has been jointly developed with domestic manufacturers to test probe cards for CIS chips with more than 50 million pixels, which can test 30 chips at a time. In the future, it can be applied to μ-LED probe cards to solve the current bottleneck that there is no suitable probe card for μ-LED wafers for mass production testing.