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Digital Dynamic Correction Applied to Low Warpage Panel Level Package

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Digital Dynamic Correction Applied to Low Warpage Panel Level Package

To meet future demands for high-speed IC computation, a 4-layer Redistribution Layer (RDL) has been developed. This RDL integrates maskless digital patterning and low-temperature sputtering technology to achieve high resolution (2μm) and low warpage (less than 0.2mm@37X47 cm²). It is suitable for high-end panel-level advanced packaging applications.

Industrial Technology Research Institute

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.

Contact

  • Name:Terry Wang

  • Phone:(03)5912570

  • Address:195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C.

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  • Pavilion:Innovation Economy Semiconductor IC19

  • Affiliated Ministry:Department of Industrial Technology,MOEA

  • Application Field:Electronics & Optoelectronics

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  • Technology maturity:Mass production

  • Exhibiting purpose:Technology transactions

  • Trading preferences:Exclusive license/assignment

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