Multiscale 3D Printing Flexible Tactile Sensor for Wearable Human-Machine Interaction and Smart Sports Applications.
Technology Introduction:
This 3D-printed flexible tactile sensor features high sensitivity (867 kPa⁻¹), fast response (10 ms), and low power use (0.1 V). It is made in minutes (<10 minutes), at a low cost. The sensor is scalable, customizable, and fits curved surfaces. Applied in badminton grips and insoles, it enables real-time monitoring of grip and foot pressure, aiding training and injury prevention, with further potential in wearables and rehabilitation.
Industry Applicability:
The device targets sports analytics, wearable health, rehabilitation, soft robotics, and smart insoles/gloves. It features customizable size and shape, flexible and lightweight form, and a digital pipeline for rapid tuning. Commercialization includes:
Phase 1 – athlete testing;
Phase 2 – OEM with sports/wearable brands;
Phase 3 – scaling via modular kits (4×4, 8×8), custom services (e.g., insoles), and real-time
Taiwan Tech has five campuses: the main Taipei campus and branch campuses at Tu-Cheng, Keelung, Gong-Guan, and Chupei, with a combined total area of 29.44 hectares. The main campus, situated in a district of Taipei with convenient transportation and beautiful surroundings, covers an area of about 10 hectares. Current enrollment includes 5,605 undergraduates and 4,902 graduate students with 415 full-time faculties.
Name:Pin-Chuan Chen
Phone:(02)2737-6456
Address:No.43, Keelung Rd., Sec.4, Da’an Dist., Taipei 10607, Taiwan
Bionic Organ of Precision Hearing: Deep Learning-Based Neural Network AIoT Approach for Noise Reduction in Next Generation Cochlear Implant
Is Ground Truth Always Correct? An Explainable Analytics Ecosystem: Understanding Misjudgments for Enhancing Decision-makings in Medicine and Recommender Systems
Cholesteric Liquid Crystal AI Electric-Optical AIoT System for Environmental Detection, Medical Test, Epidemic Prevention and Green energy applications
Pyroelectric Energy Recycle of Fluorite Hafnium Zirconium Oxide for 3D IC Package, Stacked Chip and BSPDN Application
Technology maturity:Others
Exhibiting purpose:Display of scientific results
Trading preferences:Negotiate by self
*Organization
*Name
*Phone
*Main Purpose
*Discuss Further
*Job Category
*Overall Rating
*Favorite Area
*Key Tech Focus
*Willing to Receive Updates?
Other Suggestions
Coming soon!