This technology is developed for optimizing advanced process control decision and virtual metrology for nano technology nodes for semiconductor manufacturing. The accuracy can reach up to 84.4％, while advanced process control can be improved by 5％ under the scenario of metrology delay. When new process excursion occurred especially when ramping up new technologies and products, the monitoring rules can be redefined for intelligent fault detection and classification via CNN transfer learning to effectively shorten the self-learning cycle time. It can balance the productivity and product yield while effectively shortening yield ramping and mass production time.