World Leading High Aspect Ratio Digital Lithography ＆ High Taper angle Sputtering Technologies
TRI has developed a bandpass filter on redistribution layers (RDLs) by using fan-out panel level RDL technology. And it achieves in a thinner stacking structure thickness and less circuit size consumption that can be used as an optimal solution to minimize the 5G system module.
High mobility materials, process, stacked channels, and thermal circuit simulation; Ferroelectric X:HfO2 for Negative Capacitance and POC(Proof-of-Concept) Applications; Atomic layer technologies for
Towards Automatic Hyperspectral Imaging via the Combination of Sample Navigation MappingLaser Scanning Spectral Microscopy
Deep learning-based EDA tools for lithography simulation, photomask correction, and novel layout patterns detection
Sampling and Prediction of Photolithography Process and Applications of Incremental Learning Model
Technology maturity：Experiment stage
Exhibiting purpose：Technology transactions、Patent transactions、Product promotion、Display of scientific results
Trading preferences：Exclusive license/assignment、Technical license/cooperation、Negotiate by self
Coming soon!