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The light-field 3D AR-HUD features a continuous depth range of 5-15 m and a 13° × 6° field of view, enabling precise fusion of virtual and real imagery. By integrating transparent projection and eye-tracking, it can dynamically adjust the display under complex lighting or shifting lines of sight, reducing fatigue while enhancing safety and immersion. This technology drives collaborative innovation across optics, panels, modules, and interactive systems, bridging domestic technology gaps and strengthening competitiveness in smart automotive and 3D display industries.
Innovation Economy | Electronics ＆ Optoelectronics/Life ApplicationE28 is built on leading TSMC 6nm process and Phison's exclusive patent for NAND flash serving as AI cache memory. This solution transforms traditional SSDs from passive storage devices into computational storage modules, significantly accelerating overall system performance for AI workloads. It is provided with basic computational power to offload GPU tasks, revolutionizing the current AI computing unit to greatly reduce High Bandwidth Memory (HBM) and DRAM usage and increase overall computing capability by 50% and shortens the hours of AI model training up to 90%.
Innovation Economy | Electronics ＆ OptoelectronicsAs semiconductor processes advance to the nanoscale, front-end sputtering tools face higher precision and performance demands. Our new TiN system features an adjustable cathode magnet and integrates Digital Twin tech with big data, simulation, and AI. Through multiphysics simulation and parameter optimization, we speed up design and production, improving target use and film stability. With 71+ local suppliers and our Tainan site, we reach 79% localization, showcasing Taiwan’s innovation.
Innovation Economy | Information ＆ Communications/Life ApplicationAs Moore’s Law slows, heterogeneous integration has become essential for boosting system performance and functional density. Advanced packaging now plays a central role in enabling such integration. This study develops Through-Glass Via (TGV) technology, highlighting innovative wet metallization and high-aspect-ratio electroplating processes pioneered by ITRI. These methods effectively address the adhesion and filling challenges of PVD in deep vias, offering a practical, scalable solution for next-generation heterogeneous packaging.
Innovation Economy | Information ＆ Communications/Life ApplicationGenerative AI is a pivotal trend, set to fuel economic growth and societal change, spreading from cloud computing to the edge (consumer electronics, smart homes, IoT). Existing AI designs face a "memory wall." GEMV (General Matrix-Vector multiplication) operations—high data transfer, low computation—are responsible for 60-80% of generative task latency. AI PIM (Processing-In-Memory) executes GEMV in memory, delivering 8x bandwidth and 90% less power. Its JEDEC standard interfaces ensure seamless integration for rapid large language model deployment at the edge.
Innovation Economy | Electronics ＆ OptoelectronicsaiDAPTIV+ is a one-stop solution designed for GenAI applications, offering high-efficient, secure and cost-effective GenAI training platform. This product breaks through the limitations of traditional AI computing architectures by our proprietary aiDAPTIVCache and aiDAPTIVLink technologies, enhancing GPU utilization and model training capabilities. It makes LLM training and inference more flexible. aiDAPTIV+ is an all-in-one solution designed for on-premise generative AI training, ideal for critical fields such as medical imaging, academic research, enterprise, and military. It addresses data privacy, cost, and efficiency challenges, enabling organizations to fine-tune and run models securely without relying on the cloud, while reducing long-term operational costs.
Innovation Economy | Information ＆ CommunicationsFactories face hidden costs in water treatment—high carbon emissions and scaling. Our Capacitive Deionization (CDI) system uses electric double-layer technology to remove divalent ions without chemicals, replacing ion exchange resins. With hydrophilic carbon electrodes, we deliver high recovery, low energy use, and reduced RO scaling. Ideal for industry and homes alike, CDI is a smart, sustainable step toward net-zero and cleaner water.
Innovation Economy | Materials ＆ Chemical Engineering ＆ Nanotech/Green Energy ＆ EnvironmentTechnology Overview： Utilizing innovative processes and patented technology, the Hybrid elements integrate Overvoltage and Overcurrent protection into one compact solution. They enhance the immunity against transient and repeated temporary surge , reduce thermal failure risk, and offer dual protection for downstream loads. Hybrid elements mitigate the aging issues of exiting Overvoltage protection elements and significantly extend their service life. Hybrid elements also improve reliability under surge stress, plus resettable. Compared to conventional solutions, they offer better performance and cost advantage. Industrial Applications： The FCMOV-T multi-function current protection composite overvoltage protection device is a new series developed for applications such as smart grids, smart meters, and LED lighting. It offers simultaneous overcurrent protection, overvoltage protection, and component-to-component protection. Combining a PPTC (Polymeric Positive Temperature Coefficient) overcurrent protection device with an MOV overvoltage protection device, it not only provides individual overcurrent and overvoltage protection, but also provides mutual protection between the components, preventing burnout and ensuring reusability.
Innovation Economy | Electronics ＆ OptoelectronicsTo meet the future demands of virtual-physical interactive applications, this technology integrates thin-film fabrication processes with haptic component design to develop a haptic feedback module featuring high deformation (≥0.5 mm), strong vibration intensity (≥0.5 G), and high array resolution (≥9 dots/cm²). The module delivers three distinct types of haptic feedback (deformation, vibration, and hybrid) enhancing the immersive experience. It holds potential for diverse applications in entertainment, education, and intelligent manufacturing.
Innovation Economy | Information ＆ Communications/Life ApplicationTo meet future demands for high-speed IC computation, a 4-layer Redistribution Layer (RDL) has been developed. This RDL integrates maskless digital patterning and low-temperature sputtering technology to achieve high resolution (2μm) and low warpage (less than 0.2mm@37X47 cm²). It is suitable for high-end panel-level advanced packaging applications.
Innovation Economy | Electronics ＆ OptoelectronicsWith ongoing miniaturization in electronics, traditional alkaline photoresist strippers face issues like residue and blocked vias. This technology leverages interface modifiers to improve photoresist permeability, enabling a non-toxic, ammonia-free, green stripper. Proven in industry trials, it cuts stripper use by 40%, eliminates rework, and achieves over 97% yield—enhancing efficiency and sustainability.
Innovation Economy | Green Energy ＆ Environment/Materials ＆ Chemical Engineering ＆ NanotechThe system uses a large language model to understand spoken commands and coordinate visual, speech, and tracking models for precise PTZ camera control, enabling natural human–AI interaction. Its Visual RAG architecture allows instant, one-shot object learning without large datasets. All AI models run locally, ensuring fast response, efficient performance, and strong data privacy—marking a new era of practical, real-time AI.
Innovation Economy | Life Application/Electronics ＆ Optoelectronics/Machinery ＆ SystemTo support next-generation AI computing and high-speed data analytics, ITRI developed a 1.6Tbps pluggable optical engine module using high-speed optoelectronic integration. It features low power consumption, low packaging and optical path loss. With an innovative fiber interface design, it enables efficient optical-chip integration, overcoming computing and transmission bottlenecks in traditional data centers. The module is ideal for high-performance computing applications such as AI, cloud computing, and telecommunications.
Innovation Economy | Electronics ＆ OptoelectronicsThe Industrial Technology Research Institute (ITRI) has partnered with domestic industries to provide an innovative and flexible integrated packaging service platform, centered on fan-out packaging technology. This platform offers services such as photomask sharing and small-volume, high-mix packaging, while also providing standardized structural design specifications and small-volume production services.
Innovation Economy | Information ＆ Communications/Life ApplicationThis AI-powered imaging system detects micro-contaminants in liquids efficiently, overcoming limits in identifying translucent and mixed particles. It uses deep learning to classify soft particles, crystals, hard granules, agglomerates, and bubbles, enabling real-time analysis and improved data consistency. Combining deep learning with liquid flow features, FlowTrack detects contaminants in static and dynamic states. It fits various industries, especially wet-process steps, as a key tool for quality control. It offers fast classification, tracks trends, traces sources, cuts downtime, and boosts yield and product quality.
Innovation Economy | Machinery ＆ SystemThe first large-area plasma material modification equipment under atmosphere, which induces wafer stress homogenization before processing and reduces subsequent processing damage; the process under atmosphere is easy to integrate into the current wafer cutting, grinding and polishing processes
Innovation Economy | Materials ＆ Chemical Engineering ＆ Nanotech/Machinery ＆ SystemBased on 1.7kV low on-resistance silicon carbide (SiC) power devices and low thermal resistance power module packaging, ITRI has developed an 800V/250kW high-efficiency SiC module verification platform. The stray inductance of the power loop is less than 12nH, achieving a peak efficiency of 99.14%, with more than 67.16% of the efficiency map exceeding 98%. The maximum output power reaches 216kW. This platform can be used to verify key components such as power devices, power modules, driver ICs, and microprocessor ICs, significantly shortening system verification time for manufacturers.
Innovation Economy | Machinery ＆ System/Electronics ＆ OptoelectronicsThis next-generation multimedia streaming platform combines edge AI computing with a high-performance Cortex A7 processor, built-in GPDLA (Geometry Display Area Network) and system-level DDR2 or LPDDR2. Developers can easily deploy their completed AI models to GPDLA using a conversion tool, executing tasks at a power efficiency of less than 1W. Developers can easily deploy their completed AI models to GPDLA through a conversion tool, executing tasks at a low power consumption of less than 1W and outputting results via wireless, HDMI, LCD/MIPI, etc. Alternatively, customers with different application scenarios can choose existing AI algorithms developed by Lingtong Technology in collaboration with AI algorithm developers and quickly deploy them into application products, accelerating AI implementation.
Innovation Economy | Life ApplicationComing soon!
