Innovation Pilot
The fine-pitch wafer-to-wafer hybrid bonding technology uses copper-to-copper hybrid bonding to achieve high-density, high-capacity, high-performance, low-power, low-latency, and large scale DRAM stacked packaging. The Cu/Oxide hybrid bonding process, operating at 1.06 MPa, 150°C, and 1 hour, meets the 2μm line width/spacing target, breaking through advanced packaging technology bottlenecks.
Innovation Pilot | Electronics & Optoelectronics
In today's society, spending on digital advertising is increasing, yet its effectiveness is declining. Statistics show that out of 100 visitors to a website, only 3 will make a purchase. ChiChat can automatically intercept customers who are about to leave the site and engage with them using AI technology patented in both Taiwan and Japan, guiding them towards a purchase. It has successfully helped hundreds of businesses increase their revenue by an average of 10%!
Innovation Pilot | Life Application
Smart city digital bus stops can be imported under AI guidance, which can solve problems and take care of the disadvantaged. You can get your answers right away, saving work force. What's more! The transparent screen will not block your line of sight, giving you a better field of vision. The 110-inch large touch screen is ideal for use in smart classrooms.
Innovation Pilot | Information & Communications/Life Application
0GHz antenna-array FEM, featuring ITRI's R&D in 3rd-gen. semiconductor GaN (high power density) PA, offers several significant advantages. It guarantees wider bandwidth & covers higher freq. ranges, such as 5G NR FR2, LEO satellite V-band application. Additionally, it achieves the same TX EIRP with fewer PA arrays compared to silicon-based PA processes. This results in reduced design complexity, cost, & power consumption, benefiting consumers with more efficient & cost-effective solutions ・50GHz 4x8 antenna-array ・Third-generation semiconductor GaN PA power amplifier array ・For upcoming LEO V-band satellite applications.
Innovation Pilot | Information & CommunicationsComing soon!