Next-Generation Mobile Perception Robotics
Technology Introduction:
1. Cloud-to-Chip AI DeploymentA dedicated SDK connects the Cloud AI platform directly with eYs3D Edge AI SoCs, enabling model conversion, optimization, deployment, and device management through a unified workflow. This significantly simplifies the traditional process of bringing AI models from development environments to production edge devices.
2. Open-Model AI Compression & Optimization
An integrated AI compression and optimization toolchain enables developers to optimize a wide range of open models for different edge computing constraints. Through quantization, model compression, graph optimization, and hardware-aware optimization, models can be adapted to different requirements for compute, memory, power consumption, and performance.
3. Chip-Level Deployment & Hardware-Software Co-Optimization
Instead of relying primarily on application-level AI integration, the deployment stack is designed to integrate AI models directly with the chip runtime, drivers, and middleware layers. This tighter hardware-software integration reduces unnecessary software overhead and data movement, enabling lower latency, higher hardware utilization, and more predictable edge AI performance.
Industrial Applications:
This technology can be widely applied across smart robotics, smart manufacturing, intelligent inspection, retail, transportation, healthcare, and a broad range of Physical AI edge devices. Through a unified Cloud-to-Chip deployment architecture, enterprises can manage, convert, and optimize AI models in the cloud, then deploy them directly to Edge AI chips through a dedicated SDK, significantly reducing the complexity of model migration and system integration.At the same time, the Open-Model AI Compression tool enables developers to freely select and optimize open models according to the compute, memory, power, and cost constraints of different devices, making existing AI technologies easier to deploy on low-power edge platforms. Combined with Chip-Level Hardware-Software Co-Optimization, AI workloads can be deeply integrated with the Runtime, Driver, and Middleware layers, reducing software overhead and unnecessary data movement while improving real-time performance and hardware utilization.
As a result, the same platform can be rapidly customized for different hardware configurations and application scenarios, enabling Lower Compute, Lower Cost, Faster Integration, and Faster Time-to-Market, and accelerating the transition of AI from model development to mass-produced devices and real-world deployment.
EYS3D MICROELECTRONICS, CO.
eYs3D Microelectronics is an IC design company focused on enabling Physical AI, robotics, and spatial intelligence. With semiconductor design at our core, we integrate proprietary silicon and IP, 3D vision and sensing, Edge AI, AI software, and robotic subsystems to bring intelligence from chips into real-world machines.
Our vision is to become the “LEGO of Physical AI,” providing modular and scalable building blocks through the XINK platform: XINK Core for computing and reasoning, XINK Sense for spatial perception, XINK Base for robotic platforms, and XINK Connect for software and edge-to-cloud connectivity.
From Silicon to Software to System, eYs3D enables machines to Sense, Think, Connect, and Act, helping customers accelerate the development of next-generation robots, intelligent automation systems, and Physical AI applications.
We are an IC design company — but we build beyond the chip.
Silicon. Software. System. The Building Blocks of Physical AI.
Our vision is to become the “LEGO of Physical AI,” providing modular and scalable building blocks through the XINK platform: XINK Core for computing and reasoning, XINK Sense for spatial perception, XINK Base for robotic platforms, and XINK Connect for software and edge-to-cloud connectivity.
From Silicon to Software to System, eYs3D enables machines to Sense, Think, Connect, and Act, helping customers accelerate the development of next-generation robots, intelligent automation systems, and Physical AI applications.
We are an IC design company — but we build beyond the chip.
Silicon. Software. System. The Building Blocks of Physical AI.
Contact Information
Name：Crystal Huang
Tel：02-8751-3803#2252
Address：2F, No. 22, Ln. 35, Jihu Rd., Neihu Dist., Taipei City
