Dual-Modal Perception AI Architecture
Technology Introduction:
1. Transformer-Based Dual-Modal Fusion
A Transformer-based backbone unifies Spatial/Geometric and Visual/Semantic perception within a single architecture, enabling efficient understanding of objects, spatial relationships, and scene context without relying on multiple independent AI pipelines.
2. Lower Compute Loading
Through a shared backbone, feature reuse, and efficient multi-modal fusion, the architecture reduces redundant feature extraction and computation, resulting in lower compute loading, smaller memory footprint, and lower power consumption while supporting multiple perception tasks.
3. Designed for Edge Deployment
Built from the ground up for Edge AI, the architecture enables advanced dual-modal perception without requiring high-end GPUs or large computing platforms. It can be deployed on lower-compute, low-power, and cost-efficient Edge SoCs, bringing advanced perception and intelligence directly into robots and Physical AI devices.
Transformer Backbone × Dual-Modal Perception × Lower Compute — Bringing Advanced Physical AI to Smaller Edge Platforms.
Industrial Applications:
This technology is built around Transformer-Based Dual-Modal Fusion, integrating both Spatial / Geometric Perception and Visual / Semantic Perception. It can be widely applied to Autonomous Mobile Robots (AMRs), service robots, smart manufacturing, intelligent inspection, logistics and warehousing, smart retail, and various Physical AI devices.Through a shared Transformer backbone, feature reuse, and efficient multimodal fusion, the architecture enables object recognition, spatial relationship understanding, and scene-level semantic understanding within a unified framework. This reduces redundant computation, memory usage, and power consumption typically associated with multiple independent AI pipelines.
Designed and optimized from the outset for Edge AI deployment, the architecture does not require high-end GPUs or large-scale computing platforms. Instead, it can operate on lower-compute, low-power, and cost-efficient Edge SoCs, bringing advanced perception and intelligence directly into robots and edge devices.
By reducing hardware requirements and system complexity while improving real-time performance and integration efficiency, this architecture enables scalable and production-ready environmental perception and understanding for a broader range of intelligent devices and Physical AI applications.
Industry Value: Lower Compute → Lower Power → Lower Cost → Scalable Physical AI Deployment
EYS3D MICROELECTRONICS, CO.
eYs3D Microelectronics is an IC design company focused on enabling Physical AI, robotics, and spatial intelligence. With semiconductor design at our core, we integrate proprietary silicon and IP, 3D vision and sensing, Edge AI, AI software, and robotic subsystems to bring intelligence from chips into real-world machines.
Our vision is to become the “LEGO of Physical AI,” providing modular and scalable building blocks through the XINK platform: XINK Core for computing and reasoning, XINK Sense for spatial perception, XINK Base for robotic platforms, and XINK Connect for software and edge-to-cloud connectivity.
From Silicon to Software to System, eYs3D enables machines to Sense, Think, Connect, and Act, helping customers accelerate the development of next-generation robots, intelligent automation systems, and Physical AI applications.
We are an IC design company — but we build beyond the chip.
Silicon. Software. System. The Building Blocks of Physical AI.
Our vision is to become the “LEGO of Physical AI,” providing modular and scalable building blocks through the XINK platform: XINK Core for computing and reasoning, XINK Sense for spatial perception, XINK Base for robotic platforms, and XINK Connect for software and edge-to-cloud connectivity.
From Silicon to Software to System, eYs3D enables machines to Sense, Think, Connect, and Act, helping customers accelerate the development of next-generation robots, intelligent automation systems, and Physical AI applications.
We are an IC design company — but we build beyond the chip.
Silicon. Software. System. The Building Blocks of Physical AI.
Contact Information
Name：Crystal Huang
Tel：02-8751-3803#2252
Address：2F, No. 22, Ln. 35, Jihu Rd., Neihu Dist., Taipei City
