Ultra-Low-Thermal-Budget Cu/Dielectric Hybrid Bonding Using Area-Selective Metal Passivation Technology

Technology Introduction:

Ultra-low-thermal-budget Cu/Dielectric hybrid bonding using area-selective metal passivation technology was developed based on diffusion theories. Metal passivation can achieve an ultra 120°C bonding temperature, even near room temperature under certain condition, with excellent bonding strength. Both Cu/SiO₂ and Cu/Polymer hybrid bonding were further demonstrated with the advantages of dishing compensation, excellent electrical characteristics (10⁻⁹ Ω·cm²), and JEDEC-qualified reliability.

Industrial Applications:

By integrating Ag/Au passivation and area-selective technologies, this technology can be applied to both Cu/SiO₂ and Cu/Polymer hybrid bonding platforms. Through the suppression of Cu oxidation, the bonding temperature can be reduced to 120°C or even near room temperature, while enabling ultra-fast bonding within 10 seconds. The technology demonstrates excellent electrical performance with ultra-low contact resistance (10⁻⁹ Ω·cm²) and has successfully passed reliability verification.

National Yang Ming Chiao Tung University

National Yang Ming Chiao Tung University (NYCU) was established on February 1, 2021, through the merger of National Chiao Tung University and National Yang Ming University. By integrating Chiao Tung’s strengths in information, communications, and engineering technologies with Yang Ming’s expertise in biomedical research, NYCU is committed to transcending disciplinary boundaries. The university advances interdisciplinary fields such as digital medicine, bioinformatics, smart technologies, and biomedical applications, while cultivating innovative, globally competitive talent and addressing complex real-world challenges.