When processing flexible substrates at our company, processing is performed sheet-to-sheet.
With the sheet-to-sheet method, it is possible to flow the same way as glass substrates, even with conventional infrastructure (single-wafer type equipment).
We can handle everything from small-scale prototype development to mass production.
through glass Via TGV，film eching
Enhancing Anodization of Semiconductor Materials Technology with Waf er Bonding Transforming Interface Function
Next-generation wideband surface acoustic wave communication components based on thin-film lithium niobate on insulator technology
Optical critical-dimension measuring technology for high-aspect-ratio microstructures in advanced semiconductor packaging
Hybrid CMOS Inverter Comprised of Thin Film Transistors with Hetero-channel for Monolithic 3D-ICs and Ultra-high Resolution Flat-Panel Displays Applications
Technology maturity：Mass production
Exhibiting purpose：Product promotion
Trading preferences：Negotiate by self
Coming soon!