3D-Stacking Integrating Logic and Memory Chips
- Provide industry-leading logic and memory one-stop design and value-added services.
- Compared with the traditional architecture, the bandwidth is increased by more than x10, and the energy consumption of data movement is reduced to less than 1/10
Expand the high-value and emerging business opportunities
for the DRAM industry
- The ten-fold acceleration technology of AI computing meets the high-speed computing needs from cloud to edge.
- The entire AI computing circuit will be miniaturized to the millimeter level, which is suitable for metaverse, virtual reality and various micro smart product applications.
各式積體電路其系統產品之生產、製造、測試、封裝；半導體設備零組件維修、開發、製造與銷售；研究、開發、設計及銷售下列產品：(1)特殊應用積體電路技術整合服務(2)矽智財設計與服務
Name：
Phone：03-5656000#2348
Address：No.18 Li-Hsin 1st Rd., Hsinchu Science Park, Hsinchu City
Optimizing Advanced Process Control Decision and Virtual Metrology Technology for Nano Technology Nodes for Semiconductor Manufacturing
High mobility materials, process, stacked channels, and thermal circuit simulation; Ferroelectric X:HfO2 for Negative Capacitance and POC(Proof-of-Concept) Applications; Atomic layer technologies for
AI accelerator chip architectural static performance analysis technology
"1) Integrating AI recognition, IoT, and blockchain into traceable software and hardware for recycling UCO 2) Cutting-edge 3D learning platform powered by Spatial AI 3) Optimize use of existing buildings by making them transformable and adaptive to human needs at the click of a button 4) Non-contact image analysis and calculation technology to capture vital signs through dynamic face detection"
Technology maturity：Mass production
Exhibiting purpose：Display of scientific results、Product promotion
Trading preferences：Negotiate by self
Coming soon!