The fine-pitch wafer-to-wafer hybrid bonding technology uses copper-to-copper hybrid bonding to achieve high-density, high-capacity, high-performance, low-power, low-latency, and large scale DRAM stacked packaging. The Cu/Oxide hybrid bonding process, operating at 1.06 MPa, 150°C, and 1 hour, meets the 2μm line width/spacing target, breaking through advanced packaging technology bottlenecks.
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
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