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Development and system integration of compound semiconductors and advanced packaging technologies

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Development and system integration of compound semiconductors and advanced packaging technologies

To enhance the competitiveness of wide bandgap semiconductors (GaN and SiC) in Taiwan’s and Japan’s 5G/6G communications, automotive, and renewable energy sectors, the Academy of Innovative Semiconductor and Sustainable Manufacturing, in collaboration with Institute of Science Tokyo, is leading an integrated development plan. This initiative unites academia, industry, and research institutions from both Taiwan and Japan to strengthen their global semiconductor positions and develop future talent. By closely collaborating, the teams from Taiwan and Japan will optimize device performance and packaging solutions, aiming to position both countries as leaders in these critical technologies.

NCKU-AISSM

學院開設「晶片設計學位學程」、「半導體製程學位學程」、「半導體封測學位學程」、「關鍵材料學位學程」、「智慧與永續製造學位學程」等專業領域之學位學程,五大學位學程有自行設計的必修/選修課程及學風,但五大學程彼此息息相關,鼓勵學生跨學程選課,以培育專業科技加上基本半導體通才全方位高階領導人才。本學院各學位學程涵蓋半導體產業上、中、下游區塊,除了課程可彼此整合成為教學模組,師資領域更能夠相互結合以開發前瞻研究主題。融入人工智慧(AI)、大數據分析、物聯網(IoT)、智慧製造、永續循環、綠色科技及碳中和觀念,讓學生除了半導體專業領域之外,亦能有未來科技所需全方位的訓練。

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  • Pavilion:Future Tech International Exhibitors FA08

  • Affiliated Ministry:National Science and Technology Council

  • Application Field:Materials & Chemical Engineering & Nanotech

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  • Technology maturity:Experiment stage

  • Exhibiting purpose:Display of scientific results

  • Trading preferences:Negotiate by self

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