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TGV Laser Drilling and Metallization Technology with High Aspect Ratio

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TGV Laser Drilling and Metallization Technology with High Aspect Ratio

ITRI has developed advanced laser drilling technology for TGV interposers, integrating an ultrafast laser, a self-developed adjustable optics module, and a fluorine-free etching process. This enables substrate processing with aspect ratios up to 25, meeting high-density and high-I/O demands for 3D IC packaging. Compared to mechanical drilling, it boosts speed, reduces tool wear, and cuts carbon emissions by over 40%.

Industrial Technology Research Institute

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.

Contact

  • Name:Chien-Jung Huang

  • Phone:(06)6939-007

  • Address:No. 8, Gongyan Rd., Liujia Dist., Tainan City 734045, Taiwan (R.O.C.)

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Other Information

  • Pavilion:Innovation Economy Semiconductor IC14

  • Affiliated Ministry:Department of Industrial Technology,MOEA

  • Application Field:Materials & Chemical Engineering & Nanotech、Electronics & Optoelectronics

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  • Technology maturity:Others

  • Exhibiting purpose:Display of scientific results

  • Trading preferences:Negotiate by self

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