3D Heterogeneous Integration Solutions

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The Cadence® Integrity™ 3D-IC Platform is a high-capacity, unified design and analysis platform for designing multiple chiplets. Built on the infrastructure of Cadence’s leading digital implementation solution, the Innovus™ Implementation System, the platform allows system-level designers to plan, implement, and analyze any type of stacked die system for a variety of packaging styles (2.5D or 3D). Integrity 3D-IC is the industry’s first integrated system- and SoC-level solution that enables system analysis, including co-design, with Cadence’s Virtuoso® and Allegro® analog and package implementation environments.

Cadence Design Systems, Inc.

Cadence成立於1988年，在運算軟體領域擁有超過30年的經驗，是當今電子設計的領導者。公司以智慧系統設計(Intelligent System Design)為核心策略，提供軟體、硬體及半導體IP，協助電子設計從概念走向應用實現。Cadence服務全球客戶，從晶片、印刷電路板至整體系統打造尖端與創新的電子產品，以應用於行動、消費性電子、超大型運算、5G通訊、汽車、航太、工業及健康醫療等當今最活躍的市場。Cadence是業界唯一能提供從系統設計所涵蓋的積體電路（IC）、封裝與電路板間無縫設計全流程解決方案的電子設計自動化（EDA）公司，30多年來持續驅動半導體創新。