6G FR3 RF front-end chipMassive MIMO four-port integrated antenna array technology6G FR3 RF front end module
Technology Introduction:
ITRI has developed innovative, patented four port integrated antenna technology. This technology successfully doubles the number of antennas within the same array area. The independently developed 6G FR3 band RF front-end chip shows high linearity and efficiency. The close integration of the chip and antenna module further reduces connection losses and improves module efficiency.
Industry Applicability:
As 5G progresses to 6G technology, demand for RF chips is expected to increase tenfold. The cost of RF front-end chip will be significant for 6G base station RU equipment. Therefore, the development of 6G FR3 RF chipset and antenna array technology will enhance the competitiveness of Taiwan's base station industry and help Taiwan's supply chain create 6G business opportunities.
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Name:
Phone:03-591-5719
Address:195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C.
TWI892382
High mobility materials, process, stacked channels, and thermal circuit simulation; Ferroelectric X:HfO2 for Negative Capacitance and POC(Proof-of-Concept) Applications; Atomic layer technologies for
World-class ultra-precision optical processing technology and the non-contact floating display application
Smart measurement system for advanced PCB with high speed and high frequency requirements Innovative technology for HPC 5G and High Power Filed
Monolithic 3D Heterogeneous Device Integration and Innovative Materials for Breaking Logic Density Limits: A Key Technology Platform for High-Density AI Computing Chips
Technology maturity:Others
Exhibiting purpose:Display of scientific results
Trading preferences:Technical license/cooperation
*Organization
*Name
*Phone
*Main Purpose
*Discuss Further
*Job Category
*Overall Rating
*Favorite Area
*Key Tech Focus
*Willing to Receive Updates?
Other Suggestions
Coming soon!